It is our pleasure to invite you to the fourth UCLA CHIPS Workshop on Wednesday Dec 6^th, 2023. This marks our 8^th anniversary during which time we have had a significant impact on the trajectory of advanced packaging. During our inaugural workshop in 2015, we outlined our strategy for advanced packaging – the concept of chiplets, large substrates, fine pitch assembly, flexible bio-compatible packaging platforms, and analog in-memory compute using conventional CMOS. Over the last eight years we have implemented these concepts with widespread industry adoption.

Throughout, we have stayed true to the belief that our most important product is our students and scholars. We have graduated about 16 doctoral students and an equal number of master students in this time. These graduates and scholars are making a significant impact in our industry and academia across the world.

The theme of our fourth workshop is advance packaging roadmaps. UCLA and SEMI have developed the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging. iNEMI and Sematech have developed complementary roadmaps. We will present the final version of the UCLA-SEMI roadmap along with a panel discussion on the role and importance of these roadmaps. 

UCLA Engineering has a new Dean, Alissa Park. She will outline her exciting vision for the school. This will be followed by a technical expose on Intel’s glass substrate technology and talks by K&S and AMD on fine-pitch assembly. We will round the afternoon with a talk from IBM on the NorthPole chip – which addresses AI at the edge using conventional technology. We will conclude the workshop with student posters and an optional lab tour.

Workshop registration is required as space is limited. A registration link and agenda for the workshop are available here.

The meeting will be held in the Mong Auditorium at UCLA. Instructions for arrival and parking are available here. We look forward to seeing you at the workshop.

Professor Ken Yang

Interim Director, UCLA CHIPS